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? !"" # $ $% && $$ & the apc308 consists of two independent, high gain, cmos operating amplifier, combining rail to rail out- put range with large output current. it provides a low input bias current 2pa. the output swing of the amplifier, guaranteed for loads down to 1k ? and output current to an 10 ? load from a 5v power supply. apc308 designed to oper- ating at 3v is especially well-suited for low voltage application. ? amplifiers ? ? ? ? ? operating voltage single supply 3v to 6v ? low input current 2pa ? ? ? ? ? rail to rail output swing ? ? ? ? ? push-pull output driving ? ? ? ? ? high output current drive 310ma ? ? ? ? ? bandwidth:7mhz ? ? ? ? ? wide temperature range ? ? ? ? ? available in 8 pin sop ,dip , tssop or msop package apc308 package code j : p d ip - 8 k : s o p - 8 o : ts s o p - 8 x : m s o p -8 temp. range i : - 40 to 85 c handling code tu : tube tr : tape & reel lead free code l : lead free device blank : original device handling code temp. range package code apc308 j : apc308 xxxxx xxxxx - date code apc308 k/o : apc308 xxxxx xxxxx - date code lead free code ? filters ? analog circuit ? !"" ! symbol parameter rating unit v dd supply voltage 7 v t sc(o) output short-circuit duration, at t a =25c, p tot =1w 20 s t a operating ambient temperature range -40 to 85 c t j maximum junction temperature 150 c t stg storage temperature range -65 to +150 c t s soldering temperature, 10 seconds 260 c v esd electrostatic discharge -3000 to 3000 *1 v ! "# $ v dd =5v , t a =25c (unless otherwise noted) note : *1. human body model : c=100pf , r=1500 ? , 3 positive pulses plus 3 negative pulses symbol parameter value unit r thja thermal resistance from junction to ambient in free air dip-8 so-8 tssop msop 109 180 220 220 k/w k/w k/w k/w apc308 symbol parameter condition min. typ. max. unit ta =2 5 c410mv vos input offset voltage -25 c ? !"" ' $ & apc308 symbol parameter condition min. typ. max. unit r in input resistance 5 m ? vo output voltage swing r l =2k ? 05v voh output voltage high r l =10k ? , -25 c ? !"" ( ' 0 0.5 1 1.5 2 2.5 3 3.5 4 01234567 supply current vs supply voltage supply voltage(v) supply current (ma) no load 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -25 0 25 50 75 supply current vs temperature v dd =5v supply current (ma) temperature( c) 0 1 2 3 4 5 6 7 -25 0 25 50 75 input offset voltage vs temperature v os (mv) v dd =5v temperature( c) 0 1 2 3 4 5 6 01234567 supply voltage(v) input common mode voltage vs supply voltage v icm (v) ? !"" ) output current vs output swing output swing vs load resistance output swing vs temperature ' 0 1 2 3 4 5 6 -25 0 25 50 75 v dd =5v, r l =2k ? output swing (v) temperature( c) 0.1 1 10 100 1000 0123456 v dd =5v output swing (ma) output swing (v) 0 1 2 3 4 5 6 10 100 1k 10k v dd =5v output swing (v) load resistance ( ? ) 0 1 2 3 4 5 6 7 8 01234567 output swing vs supply voltage supply voltage (v) r l =2k ? output swing (v) ? !"" * ' 0 50 100 150 200 250 300 350 400 450 500 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 sink current vs output voltage output voltage referred to ground (v) sink current (ma) 0 50 100 150 200 250 300 350 400 450 500 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 source current vs output voltage source current (ma) output voltage referred to vdd(v) large signal voltage gain vs frequency +0 +100 +10 +20 +30 +40 +50 +60 +70 +80 +90 10 10m 100 1k 10k 100k 1m frequency (hz) v dd =5v av (db) 0 1 2 3 4 5 6 10 100 1k 10k 100k 1m 10m large signal frequency response v dd =5v, r l =2k ? output swing (v) frequency (hz) v dd =5v v dd =5v ? !"" + ' 50 55 60 65 70 75 80 85 90 95 100 12345 supply voltage (v) large signal voltage gain vs supply voltage av (db) cmrr vs frequency -100 +0 -90 -80 -70 -60 -50 -40 -30 -20 -10 10 100k 100 1k 10k frequency (hz) v dd =5v,r l =10k ? cmrr (db) psrr vs frequency -80 +0 -70 -60 -50 -40 -30 -20 -10 10 100k 100 1k 10k frequency (hz) v dd =5v v rr =100mvpp/100hz psrr (db) voltage follower pulse response 0 1 2 3 4 5 6 7 8 9 -4 -3 -2 -1 0 1 2 3 4 5 0 1 2 3 4 5 time ( s) v dd =5v,r l =2k ? output voltage (v) input voltage (v) ? !"" , ' time ( s) voltage follower pulse response -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 -0.4 -0.5 0.2 -0.4 -0.3 -0.2 -0.1 0 0.1 12 034 v dd =5v,c l =270pf output voltage (v) input voltage (v) ? !"" - 1 d e1 a2 a1 a l e2 e 3 e 1 e e3 1 pdip-8 pin ( reference jedec registration ms-001) millimeters inches dim min. max. min. max. a 5.33 0.210 a1 0.38 0.015 a2 2.92 3.68 0.115 0.145 d 9.02 10.16 0.355 0.400 e1 2.54bsc 0.100bsc e2 0.36 0.56 0.014 0.022 e3 1.14 1.78 0.045 0.070 e 7.62 bsc 0.300 bsc e1 6.10 7.11 0.240 0.280 e3 10.92 0.430 l 2.92 3.81 0.115 0.150 15 ? !"" " millimeters inches dim min. max. min. max. a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 d 4.80 5.00 0.189 0.197 e 3.80 4.00 0.150 0.157 h 5.80 6.20 0.228 0.244 l 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27bsc 0.50bsc 18 8 h e e1 e2 0.015x45 d a a1 0.004max. 1 l sop-8 pin ( reference jedec registration ms-012) ? !"" millimeters inches dim min. max. min. max. a 1.2 0.047 a1 0.00 0.15 0.000 0.006 a2 0.80 1.05 0.031 0.041 b 0.19 0.30 0.007 0.012 d 2.9 3.1 0.114 0.122 e 0.65 bsc 0.026 bsc e 6.40 bsc 0.252 bsc e1 4.30 4.50 0.169 0.177 l 0.45 0.75 0.018 0.030 l1 1.0 ref 0.039ref r 0.09 0.004 r1 0.09 0.004 s 0.2 0.008 8 0 8 212 ref 12 ref ref 12 ref l (l1) (3) s (2) 0.25 gauge plane 1 b d e 2 x e / 2 8 12 e/2 e1 e 7 a1 a2 a tssop-8 ? !"" ! e1 e1 e e1 a1 a2 l2 l1 a3 millimeters inches dim min. max. min. max. a1 0.06 0.15 0.002 0.006 a2 0.86 typ 0.34 typ a3 0.25 0.4 0.01 0.0126 e 0.65 typ 0.0256typ e1 2.90 3.1 0.114 0.122 e 4.8 5.0 0.189 0.197 e1 2.90 3.1 0.114 0.122 l1 0.25 ref 0.039ref l2 0.0375 ref 0.953 ref msop ? !"" ' t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 temperature time critical zone t l to t p ' ( terminal material solder-plated copper (solder material : 90/10 or 63/37 snpb), 100%sn lead solderability meets eia specification rsi86-91, ansi/j-std-002 category 3. #) (ir/convection or vpr reflow) #) sn-pb eutectic assembly pb-free assembly profile feature large body small body large body small body average ramp-up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat temperature min (tsmin) temperature mix (tsmax) time (min to max)(ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds tsmax to t l - ramp-up rate 3 c/second max tsmax to t l temperature(t l ) time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(tp) 225 +0/-5 c 240 +0/-5 c 245 +0/-5 c 250 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package. measured on the body surface. ? !"" ( # ! ' *# a j b t2 t1 c t ao e w po p ko bo d1 d f p1 test item method description solderability mil-std-883d-2003 245 c, 5 sec holt mil-std-883d-1005.7 1000 hrs bias @125 c pct jesd-22-b,a102 168 hrs, 100 % rh, 121 c tst mil-std-883d-1011.9 -65 c~150 c, 200 cycles esd mil-std-883d-3015.7 vhbm > 2kv, vmm > 200v latch-up jesd 78 10ms, 1 tr > 100ma ? !"" ) application carrier width cover tape width devices per reel sop- 8 12 9.3 2500 tssop- 8 12 9.3 2500 + anpec electronics corp. head office : 5f, no. 2 li-hsin road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 7f, no. 137, lane 235, pac chiao rd., hsin tien city, taipei hsien, taiwan, r. o. c. tel : 886-2-89191368 fax : 886-2-89191369 (+ application a b c j t1 t2 w p e 330 1 62 +1.5 12.75+ 0.15 2 0.5 12.4 0.2 2 0.2 12 0. 3 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t sop- 8 5.5 1 1.55 +0.1 1.55+ 0.25 4.0 0.1 2.0 0.1 6.4 0.1 5.2 0. 1 2.1 0.1 0.3 0.013 application a b c j t1 t2 w p e 330 1 62 +1.5 12.75+ 0.15 2 + 0.5 12.4 0.2 2 0.2 12 0. 3 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t tssop-8 5.5 0. 1 1.5 + 0.1 1.5 + 0.1 4.0 0.1 2.0 0.1 7.0 0.1 3.6 0.3 1.6 0.1 0.3 0.013 (mm) *# |
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